Packaging

A semiconductor package is a metal, plastic, glass, or ceramic casing containing one or more discrete semiconductor devices or integrated circuits. Individual components are fabricated on semiconductor wafers (commonly silicon) before being diced into die, tested, and packaged.

• Common package solutions like leadframe or substrate-based packages (corresponding to QFN, BGA type package) as well as wafer level packaging types based on bumping, PoP. We have special expertise in System in Package(SiP) and System on a Chip(SoC) to achieve smallest footprint and allow to pre-certify solutions in fields where this is required.
• Capital Semiconductor works closely with its customers at the package design stage to ensure that design for manufacturing techniques are applied. This co-design activity is crucial in the development of a high yield, fully automated and fully optimized wire bond process.
• Capital Semiconductor die bonding systems collobrate with its customers for successfully desing and manufacturing Photonic integrated circuits, Microelectronic hybrid assemblies, and Sensor packages across their production lines. These applications are applicable across multiple industries including data centers, defense & aerospace, energy, information technology, communication, medical & healthcare.
• Encpsulation - 10-year experience of CS makes it able to supply this service for third parties, with low costs (thanks to the high level of automation) and high quality, guaranteed by an ongoing monitoring of the resin mixture and of the process.