Device and Module Analysis
With its analytical and engineering services, Capital Semiconductor provides valuable answers to their clients, by developing processes, improving existing processes, developing materials and manufacturing to improve yield in device and module production.
Capital Semiconductor offers:
- Measuring the thickness, density and composition of films
- Evaluating cleaning efficiency by measuring surface metals on wafers
- Characterizing dopant dose and profile shape
- Examining the cross-sectional structure of devices
- Visualizing surface morphology
- Determination wafer haze and discoloration
- ESD & latch-up analysis
